Venue: CAD-IT Consultants Sdn Bhd, Kelana Centre Point, Petaling Jaya, Selangor
Limited to only 10 participants

MIMOS Academy is excited to open registration for our Mastering ANSYS Simulation programme — a comprehensive, hands‑on training designed for engineers, researchers, and technical professionals involved in IC packaging, structural analysis, and finite element simulations.

This 3‑day intensive course equips participants with the latest skills and techniques to model, analyse, and optimise semiconductor packaging using ANSYS. Guided by industry practitioners, this programme offers real-world insights and practical simulation experience aligned with current industry demands.

What You Will Learn

1. Structural Analysis

• Key methods and procedures for linear static analysis
• Stress, strain, and deformation assessment for IC packages

2. Thermal & Warpage Analysis

• Understanding thermal effects on package reliability
• Warpage prediction and mitigation techniques

3. Advanced Fluid Dynamics

• Heat transfer modelling
• Fluid–structure interactions for advanced packaging environments

Why Join This Programme?

• Practical, hands-on simulation projects using Mechanical and CFD tools
• Real industrial case studies relevant to semiconductor applications
• Direct coaching and guidance from experienced technical specialists
• Suitable for professionals looking to reskill or upskill in IC packaging and FEA

Meet the Trainers

Dr. Wan Imaan Izhan
Specialised in structural, thermal, and multiphysics simulation with extensive experience in industry-level ANSYS projects.

Mohd Noor Hariz
Expert in mechanical simulation and FEA methodologies with strong hands-on experience in advanced analysis workflows.

Registration Details

• Training Fee: RM1,500 per participant (3 days)
• Materials, tools, and certificates provided

📌 Register now and secure your seat for one of the most in-demand simulation programmes for 2026.